US Patent 7550680 Package-on-package system
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Patent abstract
A package-on-package system is provided with a base package. Solder caps are provided on the top of the base package. The solder caps are configured to protrude above subsequent resin bleed, and are configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.
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US Patent 07550680 Package-on-package system US Patent 7550680 Package-on-package system
Infobox
Patent Number
0755068000
Patent Number
755068000
Edits on 23 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075506800
Date of Patent
June 23, 2009
0Patent Application Number
114242020
Date Filed
June 14, 2006
0Official Website
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075506800
Date of Patent
June 23, 2009
0Patent Application Number
114242020
Date Filed
June 14, 2006
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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Website URL
Edits on 2 Dec, 2021
Golden AI
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US Patent 07550680 Package-on-package system
Infobox
Is a
Patent jurisdiction
Patent number
07550680
Date of patent
June 23, 2009
Patent application number
11424202
Date Filed
June 14, 2006
Patent primary examiner
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