Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takayuki Fujikawa0
Yoshitada Nakao0
Masateru Tsutsumi0
Date of Patent
June 30, 2009
Patent Application Number
11460943
Date Filed
July 28, 2006
Patent Primary Examiner
Patent abstract
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced and air entrapment is prevented during the dip soldering operation, and heat fatigue resistance of solder joints is improved.
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