US Patent 7554040 Printed circuit board and soldering method and apparatus

Patent 7554040 was granted and assigned to Panasonic on June, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

All edits

Edits on 17 Sep, 2023

"Add patent inventor(s)"

Golden AI

edited on 17 Sep, 2023

Edits made to:

Infobox (+3 properties)

Infobox

Patent Inventor Names

Masateru Tsutsumi0

Takayuki Fujikawa0

Yoshitada Nakao0

Edits on 15 Sep, 2023

"Add patent abstract"

Golden AI

edited on 15 Sep, 2023

Edits made to:

Article (+444 characters)

Article

Patent abstract

A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced and air entrapment is prevented during the dip soldering operation, and heat fatigue resistance of solder joints is improved.

Edits on 25 May, 2023

"Remove website redirecting to Patent Public Search front page"

Golden AI

edited on 25 May, 2023

Edits made to:

Infobox (-1 properties)

Infobox

Official Website

https://pdfpiw.uspto.gov/.piw?Docid=07554040

"Remove leading 0 from patent number"

Golden AI

edited on 25 May, 2023