Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 7, 2009
Patent Application Number
11571289
Date Filed
June 27, 2005
Patent Primary Examiner
Patent abstract
The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
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