US Patent 7556669 Au-sn alloy powder for solder paste
Patent 7556669 was granted and assigned to Mitsubishi Materials on July, 2009 by the United States Patent and Trademark Office.
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Patent abstract
The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
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US Patent 07556669 Au-sn alloy powder for solder paste US Patent 7556669 Au-sn alloy powder for solder paste
Infobox
Patent Number
0755666900
Patent Number
755666900
Edits on 24 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075566690
Date of Patent
July 7, 2009
0Patent Application Number
115712890
Date Filed
June 27, 2005
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075566690
Date of Patent
July 7, 2009
0Patent Application Number
115712890
Date Filed
June 27, 2005
0Official Website
Patent Primary Examiner
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US Patent 07556669 Au-sn alloy powder for solder paste
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07556669
Date of patent
July 7, 2009
Patent application number
11571289
Date Filed
June 27, 2005
Patent primary examiner
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