Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Young-sang Cho0
Na-rae Shin0
Date of Patent
July 14, 2009
0Patent Application Number
118123070
Date Filed
June 18, 2007
0Patent Primary Examiner
Patent abstract
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.
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