US Patent 7560805 Semiconductor package and method of manufacturing the same
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Patent Inventor Names
Na-rae Shin0
Young-sang Cho0
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Patent abstract
A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.
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US Patent 07560805 Semiconductor package and method of manufacturing the same US Patent 7560805 Semiconductor package and method of manufacturing the same
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Patent Number
075608050
Patent Number
75608050
Edits on 23 Sep, 2022
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Patent Jurisdiction
Patent Number
075608050
Date of Patent
July 14, 2009
0Patent Application Number
118123070
Date Filed
June 18, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07560805 Semiconductor package and method of manufacturing the same
Infobox
Is a
Patent jurisdiction
Patent number
07560805
Date of patent
July 14, 2009
Patent application number
11812307
Date Filed
June 18, 2007
Patent primary examiner
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