US Patent 7564126 Integrated circuit package

An integrated circuit package comprising: an substrate having a first main surface and a second main surface which are opposite to each other; a first plurality of external terminals disposed on the first main surface of said interconnection substrate; and a second plurality of external terminals disposed on the second main surface of said interconnection substrate; wherein said second plurality of external terminals comprises a predefined selection of shared external terminals defining a first interface for an integrated circuit memory package having type NAND or type NOR memory.