Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 4, 2009
Patent Application Number
11836816
Date Filed
August 10, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
