US Patent 7571424 Diffused aerial image model semiconductor device fabrication
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Patent abstract
A lithography method has a simulation method for mathematically approximating a photoresist film pattern with a Diffused Aerial Image Model (“DAIM”) for semiconductor device fabrication. The DAIM is applied with at least two acids having heterogeneous diffusion characteristics.
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Patent Jurisdiction
Patent Number
75714240
Date of Patent
August 4, 2009
0Patent Application Number
115921420
Date Filed
November 3, 2006
0Patent Primary Examiner
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US Patent 07571424 Diffused aerial image model semiconductor device fabrication US Patent 7571424 Diffused aerial image model semiconductor device fabrication
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Patent Number
0757142400
Patent Number
757142400
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Infobox
Is a
Patent Jurisdiction
Patent Number
075714240
Date of Patent
August 4, 2009
0Patent Application Number
115921420
Date Filed
November 3, 2006
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075714240
Date of Patent
August 4, 2009
0Patent Application Number
115921420
Date Filed
November 3, 2006
0Official Website
Patent Primary Examiner
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US Patent 07571424 Diffused aerial image model semiconductor device fabrication
Infobox
Is a
Patent jurisdiction
Patent number
07571424
Date of patent
August 4, 2009
Patent application number
11592142
Date Filed
November 3, 2006
Patent primary examiner
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