Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
James Lake0
Raul Mancera0
Date of Patent
August 18, 2009
0Patent Application Number
118218670
Date Filed
June 26, 2007
0Patent Primary Examiner
Patent abstract
In one embodiment, the present invention includes a semiconductor package having a support substrate coupled to a first semiconductor die, where the first semiconductor die includes first conductive bumps, and a second semiconductor die includes second conductive bumps, and where the first and second die are coupled by joints formed of the first and second conductive bumps and a solder material therebetween. Other embodiments are described and claimed.
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