Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 18, 2009
Patent Application Number
11934793
Date Filed
November 5, 2007
Patent Primary Examiner
Patent abstract
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The redistribution layer may reroute and integrate the bonding pads of the chip and incorporate the passive components therein.
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