US Patent 7576436 Structure of wafer level package with area bump
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Patent abstract
A package structure with an area bump has at least a chip (also known as a die), a redistribution layer, a plurality of first bumps (normal bumps) and at least a second bump (area bump). The redistribution layer may reroute and integrate the bonding pads of the chip and incorporate the passive components therein.
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US Patent 07576436 Structure of wafer level package with area bump US Patent 7576436 Structure of wafer level package with area bump
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Patent Number
0757643600
Patent Number
757643600
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
075764360
Date of Patent
August 18, 2009
0Patent Application Number
119347930
Date Filed
November 5, 2007
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075764360
Date of Patent
August 18, 2009
0Patent Application Number
119347930
Date Filed
November 5, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
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US Patent 07576436 Structure of wafer level package with area bump
Infobox
Is a
Patent jurisdiction
Patent number
07576436
Date of patent
August 18, 2009
Patent application number
11934793
Date Filed
November 5, 2007
Patent primary examiner
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