Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 25, 2009
Patent Application Number
11317089
Date Filed
December 24, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating a dual damascene structure includes providing a multi-layer photoresist stack comprising a first photoresist layer and a second photoresist layer, wherein each photoresist layer has a distinct dose-to-clear value, exposing said photoresist stack to one or more predetermined patterns of light, and developing said photo-resist layers to form a multi-tiered structure in the photo-resist layers.
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