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US Patent 7582962 Heat dissipation device

Patent 7582962 was granted and assigned to Rockwell Collins on September, 2009 by the United States Patent and Trademark Office.

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Patent abstract

A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate.

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