Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Luigi Colombo0
Robert Reid Doering0
Archana Venugopal0
Benjamin Stassen Cook0
Date of Patent
May 28, 2024
0Patent Application Number
171142190
Date Filed
December 7, 2020
0Patent Citations
...
Patent Primary Examiner
Patent abstract
An integrated circuit has a substrate that includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.
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