US Patent 7582963 Vertically integrated system-in-a-package

Patent 7582963 was granted and assigned to Texas Instruments on September, 2009 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Texas Instruments

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7582963

Date of Patent

September 1, 2009

Patent Application Number

11092363

Date Filed

March 29, 2005

Patent Citations Received

‌

US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

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US Patent 11854922 Semicondutor package substrate with die cavity and redistribution layer

Patent Primary Examiner

W. David Coleman

Patent abstract

According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling one or more surface mount devices to a top surface of a second substrate, coupling the second substrate to a top surface of the first die, interconnecting the first substrate, the second substrate, and the first die, and encapsulating the first die, the second substrate and the surface mount devices.

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