US Patent 7582963 Vertically integrated system-in-a-package
Patent 7582963 was granted and assigned to Texas Instruments on September, 2009 by the United States Patent and Trademark Office.
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Patent abstract
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling one or more surface mount devices to a top surface of a second substrate, coupling the second substrate to a top surface of the first die, interconnecting the first substrate, the second substrate, and the first die, and encapsulating the first die, the second substrate and the surface mount devices.
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US Patent 07582963 Vertically integrated system-in-a-package US Patent 7582963 Vertically integrated system-in-a-package
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Patent Number
0758296300
Patent Number
758296300
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
075829630
Date of Patent
September 1, 2009
0Patent Application Number
110923630
Date Filed
March 29, 2005
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075829630
Date of Patent
September 1, 2009
0Patent Application Number
110923630
Date Filed
March 29, 2005
0Official Website
Patent Primary Examiner
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US Patent 07582963 Vertically integrated system-in-a-package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07582963
Date of patent
September 1, 2009
Patent application number
11092363
Date Filed
March 29, 2005
Patent primary examiner
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