US Patent 7597005 Pressure sensor housing and configuration
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Patent Inventor Names
Steven M. McMonigal0
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Patent abstract
A pressure sensor housing and configuration is provided for a single-square-sensor (SSS) sensing die. A sensor includes a glass wafer hermetically bonded to the SSS chip. The SSS chip is then positioned between a header and a cover, which can be glued together using an epoxy, for example. A tube, such as a pyrex tube, is connected to the SSS chip through which pressure is sensed. After bonding the wafer to the SSS chip, a vacuum seal is created and thus less emphasis is placed on hermetically sealing the remainder of the sensor.
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US Patent 07597005 Pressure sensor housing and configuration US Patent 7597005 Pressure sensor housing and configuration
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Patent Number
075970050
Patent Number
75970050
Edits on 27 Sep, 2022
Golden AI
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Patent Jurisdiction
Patent Number
075970050
Date of Patent
October 6, 2009
0Patent Application Number
115576610
Date Filed
November 8, 2006
0Official Website
Patent Primary Examiner
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US Patent 07597005 Pressure sensor housing and configuration
Infobox
Is a
Patent jurisdiction
Patent number
07597005
Date of patent
October 6, 2009
Patent application number
11557661
Date Filed
November 8, 2006
Patent primary examiner
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