US Patent 7608533 Semiconductor die attachment for high vacuum tubes

Patent 7608533 was granted and assigned to Intevac on October, 2009 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Intevac

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

76085330

Patent Inventor Names

Kenneth A Costello0

Kevin James Roderick0

Date of Patent

October 27, 2009

Patent Application Number

113240740

Date Filed

January 3, 2006

Patent Primary Examiner

‌

S. V. Clark

Patent abstract

There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.

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