US Patent 7608533 Semiconductor die attachment for high vacuum tubes
Patent 7608533 was granted and assigned to Intevac on October, 2009 by the United States Patent and Trademark Office.
All edits
Edits on 17 Sep, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Kenneth A Costello0
Kevin James Roderick0
Edits on 16 Sep, 2023
Golden AI
Edits made to:
Article (+235 characters)
Article
Patent abstract
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Edits on 24 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07608533 Semiconductor die attachment for high vacuum tubes US Patent 7608533 Semiconductor die attachment for high vacuum tubes
Infobox
Patent Number
076085330
Patent Number
76085330
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076085330
Date of Patent
October 27, 2009
0Patent Application Number
113240740
Date Filed
January 3, 2006
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 3 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07608533 Semiconductor die attachment for high vacuum tubes
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07608533
Date of patent
October 27, 2009
Patent application number
11324074
Date Filed
January 3, 2006
Patent primary examiner
Find more entities like US Patent 7608533 Semiconductor die attachment for high vacuum tubes
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
