US Patent 7629630 Electropolished patterned metal layer for semiconductor devices
Patent 7629630 was granted and assigned to Micron Technology on December, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Richard H. Lane0
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Patent abstract
An electropolishing process for high resolution patterning of noble metals, such as platinum, for forming various semiconductor devices, such as capacitors or wiring patterns is disclosed.
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US Patent 07629630 Electropolished patterned metal layer for semiconductor devices US Patent 7629630 Electropolished patterned metal layer for semiconductor devices
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Patent Number
076296300
Patent Number
76296300
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
076296300
Date of Patent
December 8, 2009
0Patent Application Number
099893720
Date Filed
November 21, 2001
0Official Website
Patent Primary Examiner
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US Patent 07629630 Electropolished patterned metal layer for semiconductor devices
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07629630
Date of patent
December 8, 2009
Patent application number
09989372
Date Filed
November 21, 2001
Patent primary examiner
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