Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 9, 2010
Patent Application Number
11069759
Date Filed
February 28, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. When an engineering change order is implemented, the existing dummy metal fill geometries are initially ignored when modifying the layout, even if this results in shorts and/or other DRC violations. Once the ECO changes have been implemented, those violations caused by interaction between the changes and the metal fill are repaired afterwards.
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