Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2010
Patent Application Number
10548544
Date Filed
March 18, 2004
Patent Primary Examiner
Patent abstract
A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
