US Patent 7661577 Imidazole compound and use thereof
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Patent abstract
A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):
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US Patent 07661577 Imidazole compound and use thereof US Patent 7661577 Imidazole compound and use thereof
Infobox
Patent Number
0766157700
Patent Number
766157700
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
076615770
Date of Patent
February 16, 2010
0Patent Application Number
105485440
Date Filed
March 18, 2004
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
076615770
Date of Patent
February 16, 2010
0Patent Application Number
105485440
Date Filed
March 18, 2004
0Official Website
Patent Primary Examiner
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US Patent 07661577 Imidazole compound and use thereof
Infobox
Is a
Patent jurisdiction
Patent number
07661577
Date of patent
February 16, 2010
Patent application number
10548544
Date Filed
March 18, 2004
Patent primary examiner
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