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US Patent 7675119 Semiconductor device and manufacturing method thereof
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Patent
Date Filed
December 7, 2007
Date of Patent
March 9, 2010
Patent Application Number
11952675
Patent Citations Received
US Patent 11972952 Atomic layer deposition on 3D NAND structures
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US Patent 12077858 Tungsten deposition
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US Patent 12002679 High step coverage tungsten deposition
0
Patent Inventor Names
Tetsuya Taguwa
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
7675119
Patent Primary Examiner
Roy K Potter
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