Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shinichi Takagi0
Junji Fujino0
Date of Patent
March 16, 2010
0Patent Application Number
119303500
Date Filed
October 31, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor device includes: a package case in which a semiconductor element is mounted, the package case having a bonding portion; a cap having a bonding portion bonded to the bonding portion of the package case so as to hermetically seal the semiconductor element; and one or more bonding/sealing wires disposed between and in contact with the bonding portion of the package case and the bonding portion of the cap such that the one or more bonding/sealing wires form a closed loop and hermetically seal the semiconductor element.
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