US Patent 7679181 Semiconductor device
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Patent abstract
A semiconductor device includes: a package case in which a semiconductor element is mounted, the package case having a bonding portion; a cap having a bonding portion bonded to the bonding portion of the package case so as to hermetically seal the semiconductor element; and one or more bonding/sealing wires disposed between and in contact with the bonding portion of the package case and the bonding portion of the cap such that the one or more bonding/sealing wires form a closed loop and hermetically seal the semiconductor element.
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Patent Inventor Names
Junji Fujino0
Shinichi Takagi0
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US Patent 07679181 Semiconductor device US Patent 7679181 Semiconductor device
Infobox
Patent Number
076791810
Patent Number
76791810
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Official Website
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Patent Jurisdiction
Patent Number
076791810
Date of Patent
March 16, 2010
0Patent Application Number
119303500
Date Filed
October 31, 2007
0Official Website
Patent Primary Examiner
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US Patent 07679181 Semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07679181
Date of patent
March 16, 2010
Patent application number
11930350
Date Filed
October 31, 2007
Patent primary examiner
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