Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 23, 2010
Patent Application Number
11973981
Date Filed
September 26, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided is a method and apparatus for close alignment of two or more electrically conductive wafers which are positioned face-to-face in closely spaced opposition, the wafers having position marks on corresponding portions thereof, the wafers being aligned as to their mating components, as guided by optically comparing the alignment of the respective position marks; deflecting an interior portion of one of the wafers into contact with the other wafer, to partially bond the wafers to each other, then fully contacting and bonding the rest of the wafer pair and then optically checking the resulting wafer alignment to see if same is acceptable.
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