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US Patent 12080554 Bonding method, bonding device, and holding member

Patent 12080554 was granted and assigned to Nikon on September, 2024 by the United States Patent and Trademark Office.

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Patent abstract

A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.

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