US Patent 12080554 Bonding method, bonding device, and holding member
Patent 12080554 was granted and assigned to Nikon on September, 2024 by the United States Patent and Trademark Office.
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US Patent 12080554 Bonding method, bonding device, and holding member
Article
Patent abstract
A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hajime Mitsuishi0
Hidehiro Maeda0
Ikuhiro Kuwano0
Isao Sugaya0
Masaki Tsunoda0
Minoru Fukuda0
Date of Patent
September 3, 2024
0Patent Application Number
172257270
Date Filed
April 8, 2021
0Patent Citations
Patent Primary Examiner
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