Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Shiung Tsai0
Ru-Liang Lee0
Yen-Chang Chu0
Yeur-Luen Tu0
Cheng-Yuan Tsai0
Chih-Hui Huang0
Kuan-Liang Liu0
Ping-Yin Liu0
Date of Patent
November 8, 2016
0Patent Application Number
145927880
Date Filed
January 8, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.
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