Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Shiung Tsai0
Sheng-Chau Chen0
Xiaomeng Chen0
Yeur-Luen Tu0
Chih-Hui Huang0
Chun-Han Tsao0
Date of Patent
December 5, 2017
0Patent Application Number
141634600
Date Filed
January 24, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.
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