US Patent 9837291 Wafer processing method and apparatus
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Patent abstract
An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.
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Patent Inventor Names
Chia-Shiung Tsai0
Chih-Hui Huang0
Chun-Han Tsao0
Sheng-Chau Chen0
Xiaomeng Chen0
Yeur-Luen Tu0
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US Patent 09837291 Wafer processing method and apparatus US Patent 9837291 Wafer processing method and apparatus
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Patent Number
098372910
Patent Number
98372910
Edits on 6 Apr, 2023
Golden AI
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Is a
Patent Jurisdiction
Patent Number
098372910
Date of Patent
December 5, 2017
0Patent Application Number
141634600
Date Filed
January 24, 2014
0Patent Primary Examiner
Edits on 16 Jan, 2022
Golden AI
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US Patent 09837291 Wafer processing method and apparatus
Infobox
Is a
Patent jurisdiction
Patent number
09837291
Date of patent
December 5, 2017
Patent application number
14163460
Date Filed
January 24, 2014
Patent primary examiner
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