Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 23, 2010
Patent Application Number
11011640
Date Filed
December 14, 2004
Patent Primary Examiner
Patent abstract
A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
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