US Patent 7682934 Wafer packaging and singulation method
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Patent abstract
A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
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US Patent 07682934 Wafer packaging and singulation method US Patent 7682934 Wafer packaging and singulation method
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Patent Number
0768293400
Patent Number
768293400
Edits on 25 May, 2023
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
076829340
Date of Patent
March 23, 2010
0Patent Application Number
110116400
Date Filed
December 14, 2004
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
076829340
Date of Patent
March 23, 2010
0Patent Application Number
110116400
Date Filed
December 14, 2004
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07682934 Wafer packaging and singulation method
Infobox
Is a
Patent jurisdiction
Patent number
07682934
Date of patent
March 23, 2010
Patent application number
11011640
Date Filed
December 14, 2004
Patent primary examiner
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