Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 6, 2010
Patent Application Number
10989517
Date Filed
November 17, 2004
Patent Primary Examiner
Patent abstract
A wiring substrate includes a lower insulating resin layer; wiring pattern layers provided on surfaces of the lower insulating resin layer; upper insulating resin layers; and via holes and via conductors connected electrically with at least one of the wiring pattern layers. An upper insulating resin layer includes an epoxy resin containing 30 to 50% by weight of an inorganic filler of SiO2 having an average grain diameter of 1.0 to 10.0 μm, and a via having a lower end opening diameter of between 40 μm and 60 μm.
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