US Patent 7692317 Apparatus for housing a micromechanical structure
Patent 7692317 was granted and assigned to Infineon Technologies on April, 2010 by the United States Patent and Trademark Office.
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Patent abstract
Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
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Patent Inventor Names
Andreas Meckes0
Klaus-Gunter Oppermann0
Martin Franosch0
Winfried Nessler0
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US Patent 07692317 Apparatus for housing a micromechanical structure US Patent 7692317 Apparatus for housing a micromechanical structure
Infobox
Patent Number
076923170
Patent Number
76923170
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076923170
Date of Patent
April 6, 2010
0Patent Application Number
118644480
Date Filed
September 28, 2007
0Official Website
Patent Primary Examiner
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Website URL
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US Patent 07692317 Apparatus for housing a micromechanical structure
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07692317
Date of patent
April 6, 2010
Patent application number
11864448
Date Filed
September 28, 2007
Patent primary examiner
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