US Patent 7694413 Method of making a bottomless via
Patent 7694413 was granted and assigned to Intel on April, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method for forming a copper interconnect is described. An opening in a dielectric layer disposed on a substrate is formed. A barrier layer is formed on the opening. A seed layer is formed on the barrier layer. The seed layer includes a noble metal copper alloy, the copper having less than 50% of the atomic weight of the noble metal copper alloy.
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Patent Citations Received
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US Patent 07694413 Method of making a bottomless via US Patent 7694413 Method of making a bottomless via
Infobox
Patent Number
0769441300
Patent Number
769441300
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076944130
Date of Patent
April 13, 2010
0Patent Application Number
114793990
Date Filed
June 30, 2006
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076944130
Date of Patent
April 13, 2010
0Patent Application Number
114793990
Date Filed
June 30, 2006
0Official Website
Patent Primary Examiner
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US Patent 07694413 Method of making a bottomless via
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07694413
Date of patent
April 13, 2010
Patent application number
11479399
Date Filed
June 30, 2006
Patent primary examiner
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