Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 7710687 High conductivity ground planes for integrated lead suspensions

Patent 7710687 was granted and assigned to Hutchinson Technology Inc. on May, 2010 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Patent abstract

An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7710687 High conductivity ground planes for integrated lead suspensions

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo