US Patent 7710687 High conductivity ground planes for integrated lead suspensions
Patent 7710687 was granted and assigned to Hutchinson Technology Inc. on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.
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Patent Inventor Names
Keith W. Carlson0
Larry C. Webb, Jr.0
Valerie J. Webber0
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US Patent 07710687 High conductivity ground planes for integrated lead suspensions US Patent 7710687 High conductivity ground planes for integrated lead suspensions
Infobox
Patent Number
077106870
Patent Number
77106870
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077106870
Date of Patent
May 4, 2010
0Patent Application Number
115314680
Date Filed
September 13, 2006
0Official Website
Patent Primary Examiner
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US Patent 07710687 High conductivity ground planes for integrated lead suspensions
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07710687
Date of patent
May 4, 2010
Patent application number
11531468
Date Filed
September 13, 2006
Patent primary examiner
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