Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 11, 2010
Patent Application Number
11735362
Date Filed
April 13, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
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