US Patent 7715080 Packaging a MEMS device using a frame
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Patent abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
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US Patent 07715080 Packaging a MEMS device using a frame US Patent 7715080 Packaging a MEMS device using a frame
Infobox
Patent Number
0771508000
Patent Number
771508000
Edits on 29 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077150800
Date of Patent
May 11, 2010
0Patent Application Number
117353620
Date Filed
April 13, 2007
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077150800
Date of Patent
May 11, 2010
0Patent Application Number
117353620
Date Filed
April 13, 2007
0Official Website
Patent Primary Examiner
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US Patent 07715080 Packaging a MEMS device using a frame
Infobox
Is a
Patent jurisdiction
Patent number
07715080
Date of patent
May 11, 2010
Patent application number
11735362
Date Filed
April 13, 2007
Patent primary examiner
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