Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 18, 2010
Patent Application Number
11587051
Date Filed
February 21, 2005
Patent Primary Examiner
Patent abstract
The component placement substrate of the present invention can be produced easily with suppressed cracks in a thin film formed on a pattern film of the substrate. The present invention provides a component placement substrate provided with one or more pattern films on a substrate, wherein at least one of the pattern film(s) has a cross-sectional shape composed of a semi-elliptical circular upper part, and one of a forward taper shaped lower part and a approximately vertical taper shaped lower part and the average thickness of the lower part is 50 Å or larger and 3,000 Å or smaller.
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