US Patent 7718903 Component placement substrate and production method thereof
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Patent abstract
The component placement substrate of the present invention can be produced easily with suppressed cracks in a thin film formed on a pattern film of the substrate. The present invention provides a component placement substrate provided with one or more pattern films on a substrate, wherein at least one of the pattern film(s) has a cross-sectional shape composed of a semi-elliptical circular upper part, and one of a forward taper shaped lower part and a approximately vertical taper shaped lower part and the average thickness of the lower part is 50 Å or larger and 3,000 Å or smaller.
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US Patent 07718903 Component placement substrate and production method thereof US Patent 7718903 Component placement substrate and production method thereof
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Patent Number
0771890300
Patent Number
771890300
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Patent Jurisdiction
Patent Number
077189030
Date of Patent
May 18, 2010
0Patent Application Number
115870510
Date Filed
February 21, 2005
0Official Website
Patent Primary Examiner
Edits on 28 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
077189030
Date of Patent
May 18, 2010
0Patent Application Number
115870510
Date Filed
February 21, 2005
0Official Website
Patent Primary Examiner
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US Patent 07718903 Component placement substrate and production method thereof
Infobox
Is a
Patent jurisdiction
Patent number
07718903
Date of patent
May 18, 2010
Patent application number
11587051
Date Filed
February 21, 2005
Patent primary examiner
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