Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
William E. Murphy0
David L. Vos0
Richard Shields0
Ryan S. Riegle0
Date of Patent
May 18, 2010
0Patent Application Number
110325260
Date Filed
January 10, 2005
0Patent Primary Examiner
Patent abstract
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
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