Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 25, 2010
Patent Application Number
10629684
Date Filed
July 30, 2003
Patent Primary Examiner
Patent abstract
A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic part; and carrying out connecting to the nickel plating coat through a lead-free solder, wherein a half-width of X-ray diffraction of a (111) plane of Ni crystal in the nickel plating coat is 5 degrees or less.
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