US Patent 7721425 Method for connecting electronic parts
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Patent abstract
A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic part; and carrying out connecting to the nickel plating coat through a lead-free solder, wherein a half-width of X-ray diffraction of a (111) plane of Ni crystal in the nickel plating coat is 5 degrees or less.
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US Patent 07721425 Method for connecting electronic parts US Patent 7721425 Method for connecting electronic parts
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Patent Number
0772142500
Patent Number
772142500
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Is a
Patent Jurisdiction
Patent Number
077214250
Date of Patent
May 25, 2010
0Patent Application Number
106296840
Date Filed
July 30, 2003
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077214250
Date of Patent
May 25, 2010
0Patent Application Number
106296840
Date Filed
July 30, 2003
0Official Website
Patent Primary Examiner
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US Patent 07721425 Method for connecting electronic parts
Infobox
Is a
Patent jurisdiction
Patent number
07721425
Date of patent
May 25, 2010
Patent application number
10629684
Date Filed
July 30, 2003
Patent primary examiner
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