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US Patent 7723855 Pad and circuit board, electronic device using same

Patent 7723855 was granted and assigned to Hon Hai Precision Industry Co Ltd on May, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A pad for soldering a contact of a surface mounted component is provided herein. The pad includes a central portion and a plurality of separate extending portions extending from the central portion. All of the plurality of separate extending portions includes a free end and a connected end connected to the central portion. A width of the free end is larger than a width of the connected end. A circuit board and an electronic device are also provided.

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