US Patent 7723855 Pad and circuit board, electronic device using same
Patent 7723855 was granted and assigned to Hon Hai Precision Industry Co Ltd on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A pad for soldering a contact of a surface mounted component is provided herein. The pad includes a central portion and a plurality of separate extending portions extending from the central portion. All of the plurality of separate extending portions includes a free end and a connected end connected to the central portion. A width of the free end is larger than a width of the connected end. A circuit board and an electronic device are also provided.
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US Patent 07723855 Pad and circuit board, electronic device using same US Patent 7723855 Pad and circuit board, electronic device using same
Infobox
Patent Number
0772385500
Patent Number
772385500
Edits on 22 May, 2023
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Official Website
Edits on 23 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077238550
Date of Patent
May 25, 2010
0Patent Application Number
119670980
Date Filed
December 29, 2007
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077238550
Date of Patent
May 25, 2010
0Patent Application Number
119670980
Date Filed
December 29, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
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Edits on 4 Dec, 2021
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US Patent 07723855 Pad and circuit board, electronic device using same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07723855
Date of patent
May 25, 2010
Patent application number
11967098
Date Filed
December 29, 2007
Patent primary examiner
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